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?Placement Speed : 11,000 CPH (Optimum)
?The Number of Spindles : 1 Gantry x 3 Spindle
?Component Range : 0402~□ 55mm/ ~L74 mm x W55mm (H15mm)
?Placement Accuracy : ±40 μm @ Cpk ≥ 1.0/Chip
±30 μm @ Cpk ≥ 1.0/Lead,BGA
?PCB Size : ~L510 x W580, Single lane
~L750 x W580(Max Option)
~L510 x W310, Dual lane
~L750 x W310(Max Option)
?靈活的PCB處(chu)理能力
?使用Outbuffer
?使(shi)用PBI(Post Bonding Inspection)功(gong)能檢查(cha)元器(qi)件的貼裝(zhuang)不良(liang)
?Height Sensor
?Backlight識(shi)別
?NPE(New Part editor)
?Panorama View
?提高了外(wai)圍設備(bei)的使(shi)用便(bian)利(li)性(xing)
