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?Placement Speed : 11,000 CPH (Optimum)
?The Number of Spindles : 1 Gantry x 3 Spindle
?Component Range : 0402~□ 55mm/ ~L74 mm x W55mm (H15mm)
?Placement Accuracy : ±40 μm @ Cpk ≥ 1.0/Chip
±30 μm @ Cpk ≥ 1.0/Lead,BGA
?PCB Size : ~L510 x W580, Single lane
; ~L750 x W580(Max Option)
~L510 x W310, Dual lane
~L750 x W310(Max Option)
?靈活的PCB處理能力
?使用(yong)Outbuffer
?使(shi)用PBI(Post Bonding Inspection)功能檢查元器件的貼裝不良
?Height Sensor
?Backlight識(shi)別
?NPE(New Part editor)
?Panorama View
?提(ti)高了外圍設備的(de)使用便利性
